Supply of Laser Dicing and Drilling System to Compound Semiconductor Applications Catapult

About

Compound Semiconductor Applications (CSA) Catapult Limited awarded a contract to M-SOLV LTD for the supply of a laser dicing and drilling system to support a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems.

The system is intended for research, proof of concept, and small volume prototype builds, not mass production.

It is required to handle a wide range of semiconductor materials (silicon, silicon carbide, gallium arsenide, gallium nitride, alumina) and ceramics with thicknesses from 100 micrometres up to 1.5 mm, and to drill holes as small as 20 micrometres in diameter with surface roughness less than 1 micron.

The equipment must achieve high-quality diced edges and drilled holes with a minimum laser taper angle of less than 8 degrees, preferably a 90-degree cut, and support high drilling aspect ratios up to 40:1.

It includes full-cut dicing, tape removal after dicing, and a visual monitoring system for inspection during dicing and drilling.

The contract value is AUD 295,000.