COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED · Awarded contract
Awarded

Supply and Installation of Metal 3D Printer for Compound Semiconductor Applications Catapult

Awarded 29 Jun 2021

View live tenders
Awarded29 Jun 2021
Value£705,000.00
SupplierDIGTAL METAL AB
AgencyCOMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED
RegionWales
CategoryManufacturing & Industrial
Ended 1y 4mo ago4y term
Awarded 29 June 2021Expired 28 June 2025

About

Compound Semiconductor Applications (CSA) Catapult awarded a contract to Digital Metal AB for the supply and installation of a metal 3D printer to support the creation of a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices.

The equipment will produce customised prototype metal parts using additive manufacturing technology, processing metals such as copper, nickel alloys, and stainless steels, to support the Driving the Electric Revolution - Industrialisation Centres (DERIC) programme and hybridisation programmes.

The contract, valued at AUD 705,000, includes installation at CSA Catapult's Innovation Centre, training, warranty, and service/maintenance support.

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