Compound Semiconductor Applications Catapult · Awarded contract

Awarded

Supply of Die Bonder for Advanced Packaging Laboratory at CSA Catapult

Awarded 23 May 2019

View live tenders

Awarded23 May 2019

Value£146,000.00

SupplierINSETO (UK) LIMITED

AgencyCompound Semiconductor Applications Catapult

RegionUnited Kingdom

CategoryManufacturing & Industrial

Ended 4y 6mo ago3y term

Awarded 23 May 2019Expired 22 May 2022

About

Compound Semiconductor Applications Catapult awarded a contract to INSETO (UK) LIMITED for the supply of a die bonding machine to support a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems.

The equipment enables manual and semi-automatic bonding for experimentation and low-volume prototype builds, adaptable to bond components from chip level through module level using organic-inorganic substrates, various adhesives, and PCBs for standard industry package units, multi-chip modules, and System-in-Package solutions.

The system will be installed in the Advanced Packaging Laboratory at the CSA Catapult Innovation Centre.

The contract value is AUD 146,000.

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2 new manufacturing and industrial tenders

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