Supply of Automated Multipurpose Wire Bonder to Compound Semiconductor Applications Catapult

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Compound Semiconductor Applications Catapult awarded a contract to Accelonix Limited for an automated multipurpose wire bonder to support the creation of a modular, flexible, accelerated prototype package assembly and test facility for RF, Photonics, and Power compound semiconductor devices, modules, and systems.

The equipment enables manual and automated bonding for experimentation and low-volume prototype builds, adaptable to wire bond a wide variety of components from chip level through to module level using organic-inorganic substrates and PCBs for package architectures including standard industry package units, multi-chip modules, and System-in-Package solutions.

The system will be installed in the CSA Catapult Innovation Centre within the Advanced Packaging Laboratory.

The contract value is AUD 169,000.