COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED · Awarded contract
Awarded

Supply and Installation of Lapping and Polishing Machine for CSA Catapult

Awarded 30 May 2021

View live tenders
Awarded30 May 2021
Value£100,000.00
SupplierENGIS (UK) LTD
AgencyCOMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED
RegionWales
CategoryManufacturing & Industrial
Ended 1y 5mo ago4y term
Awarded 30 May 2021Expired 29 May 2025

About

Compound Semiconductor Applications Catapult Limited awarded a contract to ENGIS (UK) LTD for the supply and installation of a lapping and polishing machine to support the prototyping and assembly of RF, photonics, and power compound semiconductor devices.

The machine is required to handle a wide range of metals and ceramics, including copper, aluminium, titanium, beryllium, molybdenum, alumina, zirconium oxide, fused silica, silicon carbide, and silicon nitride, with lapping and polishing capabilities from 25 µm down to 50 nm and from 25 µm up to 50 µm.

It must process 2D and 3D parts ranging in size from 130 x 130 x 130 mm to 250 x 250 x 250 mm, with lapping plate dimensions from 15" to 28".

The contract includes installation at the Innovation Centre, CSA Catapult, along with necessary training, warranty, and service/maintenance support.

The contract value is AUD 100,000.

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