Supply, Delivery and Installation of a Wafer Dicing Saw for the University of Strathclyde
University of Strathclyde · Awarded contract
AwardedSupply, Delivery and Installation of a Wafer Dicing Saw for the University of Strathclyde
Awarded Unknown
AwardedNot specified
Value£57,000.00
SupplierDisco Hi-Tech UK Ltd
RegionScotland
CategoryManufacturing & Industrial
About
The University of Strathclyde awarded a contract to Disco Hi-Tech UK Ltd for the supply, delivery and installation of a wafer dicing saw, valued at £57,000.
The equipment is intended for the Department of Physics and will be used primarily for dicing 150 mm diameter wafer stacks of glass and silicon.
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Supply, Delivery and Installation of a Wafer Dicing Saw for the University of Strathclyde
Won by Disco Hi-Tech UK Ltd · University of Strathclyde
£57Kawarded
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Turnkey FTIR System for Continuous DRE Monitoring of Semiconductor Abatement Systems – Swansea UniversityResearch & Development · Closes 9 Nov 2026
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