Supply and Delivery of UV Curing System for Semiconductor Packaging at University of Strathclyde
University of Strathclyde · Awarded contract
AwardedSupply and Delivery of UV Curing System for Semiconductor Packaging at University of Strathclyde
Awarded Unknown
AwardedNot specified
Value£49,600.00
SupplierPOWATEC GmbH
RegionScotland
CategoryManufacturing & Industrial
About
The University of Strathclyde awarded a contract to POWATEC GmbH for the supply and delivery of a UV curing system for use with taped wafers.
The equipment supports a bond-interconnect-package line for semiconductor wafers and dies in discrete power devices and modules, enabling research on materials and processes for semiconductor manufacturing.
This is part of a publicly funded project to create an advanced scale-up packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS), housed in an ISO-7 clean room and available to academic and industrial partners across the UK.
The contract value is AUD 49,600.
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Supply and Delivery of UV Curing System for Semiconductor Packaging at University of Strathclyde
Won by POWATEC GmbH · University of Strathclyde
£50Kawarded
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Turnkey FTIR System for Continuous DRE Monitoring of Semiconductor Abatement Systems – Swansea UniversityResearch & Development · Closes 9 Nov 2026
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