University of Strathclyde · Public Contracts Scotland

Closed

Tender: Supply and Commissioning of Submicron Flip‑Chip Die Bonder and Hermetic Sealing Equipment – University of Strathclyde (NCASP)

Released 3 months ago

Closed04 Sep 2026

Est. valueEstimate£50K to £360K

LocationScotland

AgencyUniversity of Strathclyde

SourcePublic Contracts Scotland

CategoryManufacturing & Industrial

Submissions closedClosed Fri, 4 Sept 2026

About

The University of Strathclyde is seeking a supplier for the supply, delivery, installation and commissioning of a submicron flip‑chip die bonder and an advanced hermetic sealing capability consisting of seam sealing and projection welding for hermetic packages used in photonic and advanced semiconductor packaging. This procurement supports the National Centre for Advanced Semiconductor Packaging (NCASP) in creating an integrated, industry‑led scale‑up facility to connect UK device design to domestic high‑volume packaging, test and metrology and to reduce time‑to‑market and onshore value leakage.

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University of Strathclyde

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2 new manufacturing and industrial tenders

Supply, Installation and Maintenance of High-Resolution Maskless UV (375 nm) Aligner for Great Northeast Nanofab – Newcastle UniversityResearch & Development · Closes 27 Nov 2026

Supply and Commissioning of Advanced Fluorescence Microscope (Widefield, Confocal, Super-Resolution) — Heriot-Watt University, EdinburghResearch & Development · Closes 16 Nov 2026

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