Supply of Flip Chip Bonder to UKRI-STFC for Radiation Detector Assembly

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UK SHARED BUSINESS SERVICES LIMITED awarded a contract to SET Corporation SA for the supply of a flip chip bonder to UK Research and Innovation's Science and Technology Facilities Council (UKRI-STFC).

The equipment will be used to assemble radiation-sensitive detectors, including hybrid pixel sensors that bond CMOS readout integrated circuits to solid-state sensor materials such as silicon, germanium, cadmium telluride, cadmium zinc telluride, gallium arsenide, and gallium antimonide.

The bonder must accommodate small-volume runs of 1-5 units as well as higher-volume assemblies of up to 2000-3000 units, with rapid reconfiguration between runs.

The contract supports UKRI-STFC's assembly facility upgrade, which includes relocation to new custom-built premises and aims to enhance bonding and assembly capabilities, increase capacity, and enable denser pixel packing.

The contract value is £899,801.47.