University of Strathclyde · Find a Tender

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Tender: Supply, Delivery and Installation of Solder Jetting Equipment for NCASP – UK Semiconductor Packaging

Released 3 months ago

Closed31 Aug 2026

Est. valueEstimate£45K to £230K

LocationScotland

AgencyUniversity of Strathclyde

SourceFind a Tender

CategoryManufacturing & Industrial

Submissions closedClosed Mon, 31 Aug 2026

About

The National Centre for Advanced Semiconductor Packaging (NCASP) is seeking a supplier for the supply, delivery and installation of a solder jetting capability to process photonic and semiconductor devices and enable their integration into advanced packages. NCASP is creating an integrated, industry-led, open-access scale-up facility to connect UK device design to domestic high-volume packaging, test and metrology, reducing time-to-market and anchoring value onshore to address supply chain fragmentation, lead-time issues and IP leakage risks associated with reliance on overseas OSAT facilities.

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University of Strathclyde

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2 new manufacturing and industrial tenders

Supply and Delivery of Single‑Use Injection Equipment and Naloxone for NHS Scotland and Participating AuthoritiesHealth & Medical · Closes 19 Nov 2026

Supply, Installation and Commissioning of Fibre Laser Cutter to Supplement Existing Waterjet CutterManufacturing & Industrial · Closes 18 Dec 2026

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