University of Strathclyde · Find a Tender

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Tender: Supply, Delivery and Installation of Wafer‑Level Optical Tester for DFB Laser Arrays and Silicon Photonic ICs – University of Strathclyde

Released 3 months ago

Closed07 Sep 2026

Est. valueEstimate£30K to £200K

LocationScotland

AgencyUniversity of Strathclyde

SourceFind a Tender

CategoryManufacturing & Industrial

Submissions closedClosed Mon, 7 Sept 2026

About

University of Strathclyde is seeking a supplier for wafer-level optical tester(s) capable of performing characterization of both surface-emitting Distributed Feedback (DFB) laser arrays and silicon photonic integrated circuits (PICs). This requirement supports the National Centre for Advanced Semiconductor Packaging (NCASP) effort to create a sovereign, open-access advanced semiconductor packaging capability and an integrated, industry-led scale-up facility that converts research excellence into manufacturable products, reduces time-to-market and anchors packaging, test and metrology value onshore. The equipment will be used to enable domestic high-volume packaging, test and metrology for UK photonics and power electronics innovators.

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2 new manufacturing and industrial tenders

Supply and Commissioning of Advanced Fluorescence Microscope (Widefield, Confocal, Super-Resolution) — Heriot-Watt University, EdinburghResearch & Development · Closes 16 Nov 2026

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